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Product for Package


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Advanced Package

TMV® (Through Mold Via)
SiP (System in Package)
WLCSP (Wafer Level Chip Scale Package)

button-datasheet


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Chip Scale Package

CABGA (ChipArray® Ball Grid Array)
SCSP (Stacked Chip Scale Package)
fcCSP (flip chip Chip Scale Package)

button-datasheet


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Ball Grid Array

fcBGA (flip chip Ball Grid Array)
PBGA (Plastic Ball Grid Array)

button-datasheet


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Lead Frame

MLF (MicroLeadFrameTM)
QFP (Quad Flat Package)

button-datasheet